High Quality Kellyshun K-636B 183c Solder Paste - 50g The Kellyshun 183°C Solder Paste is a high-performance leaded soldering paste designed specifically for high-precision electronics manufacturing, PCB assembly, and complex component repairs like SMD, BGA, and IC reballing.

Key Technical Specifications ● Alloy Composition: Eutectic Sn63/Pb37 (63% Tin, 37% Lead) or Sn62.8/Pb36.8/Ag0.4 depending on exact formulation variant. ● Melting Point: 183°C (361.4°F), which ensures quick, uniform melting without over-heating sensitive electronic components. ● Weight / Packaging: 50g net weight container, frequently packaged in syringe/needle-tube form factors for precise manual application. ● Flux Classification: No-Clean formulation, meaning the remaining minimal rosin core residue behaves as a non-conductive, anti-corrosive layer that doesn't strictly require post-solder chemical washing

High Quality Kellyshun K-636B 183c Solder Paste - 50g

The Kellyshun 183°C Solder Paste is a high-performance leaded soldering paste

designed specifically for high-precision electronics manufacturing,

PCB assembly, and complex component repairs like SMD, BGA, and IC reballing.

Key Technical Specifications

• Alloy Composition: Eutectic Sn63/Pb37 (63% Tin, 37% Lead) or Sn62.8/Pb36.8/Ag0.4 depending on exact formulation variant.
• Melting Point: 183°C (361.4°F), which ensures quick, uniform melting without over-heating sensitive electronic components.
• Weight / Packaging: 50g net weight container, frequently packaged in syringe/needle-tube form factors for precise manual application.
• Flux Classification: No-Clean formulation, meaning the remaining minimal rosin core residue behaves as a non-conductive,

anti-corrosive layer that doesn't strictly require post-solder chemical washing